PI refers to a kind of polyimide resin material, which is now widely used in various fields and is a material with very good performance. Some people call PI a landmark material that can promote the reform of electronic products. The following small editor mainly describes the location and function of FPC circuit board and PI.

PI is a material with excellent high temperature resistance, which will be used in aerospace technology. PI has two main positions in the circuit board.

Relationship between FPC soft board and PI

1. As a soft board base plate

This is the material used by most circuit boards. The substrate mainly plays the role of strengthening and thickening, mainly because the copper foil of the circuit board is very thin, which is not enough to support the adhesive and covering film alone. In this position of use, PI mainly has the thickness of multi-layer PI for lamination, and single-layer PI is also very thin.

PI is not only one of the materials used as the substrate, but also PET, FR4, ET, etc. However, due to the impact of material shrinkage during the production of flexible boards, PI is mostly used as the insulating material in the production of FPC flexible circuit boards for the sake of production yield and efficiency, unless other materials are required by customers themselves.

2. As covering film

The single-layer PI is very thin, and PI has many properties, not only can withstand high temperature, but also is excellent in wear resistance and insulation. Therefore, PI is often used as the protective film in the place where the circuit board gold finger is used. The main reason is that the gold finger needs a lot of connectors to be embedded for a variable number of times, and the use of ordinary covering film for a long time is easy to cause damage to the gold finger.